Metcal has announced that Paul Wood, Advanced Product Applications Manager, will participate in an expert panel conducted by Global SMT & Packaging Magazine during SMTA International. The panel, entitled, “Rework and Repair – Challenges,” is scheduled to take place Wednesday September 28, 2016.
Reworking PCB assemblies is becoming increasingly challenging. This expert panel will discuss some of the techniques and processes for dealing with:
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Mr. Wood is an industry expert in the BGA/CSP/Array package rework arena. With 34 years of service at OK International, Inc., and 43 years’ experience in the electronics industry, Mr. Wood has used his global experience in rework to keep electronic assembly manufacturers on the leading-edge of technology.
