---
title: Metcal Blog | Soldering, Desoldering, Electronics Rework Applications, News, Tips and Trends | BGA
description: BGA | Applications, tips and trends in hand soldering, rework, repair and desoldering.  Metcal is one of the world's leading brands in soldering stations, rework stations, fume extraction and benchtop accessories.
---

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# Metcal Blog

## [Metcal Team to Present on Rework and Risk Mitigation at IPC APEX 2017](https://info.techcon.com/metcal/metcal-whitepapers-risk-mitigation-and-rework-challenges)

 By [Metcal Marketing](https://info.techcon.com/metcal/author/metcal-marketing) on Feb 8, 2017 6:29:51 PM

[![](http://info.okinternational.com/hubfs/Paul%20Wood%20Portrait.jpg)](https://info.techcon.com/metcal/metcal-whitepapers-risk-mitigation-and-rework-challenges)

Metcal will be presenting two white papers at IPC APEX 2017 in San Diego this February 14-16. Take a look at a summary of what our engineers will be presenting:

When: Wednesday, Feb. 15th, 1:30 -3:00 PM  
What: Panel: S17: Rework I  
Location: 1A

**Rework Challenges for Leading Edge Components BGA, QFN and LED in Today’s Fast Moving Industry**

**(see also below: Risk Mitigation in Hand Soldering)**

##### **Presented by Paul Wood, Metcal Advanced Product Applications Manager                                        **

The electronics assembly industry continues to face the challenges associated with BGA, QFN, and LED packages. The demand for more performance by consumers drives change, which results in greater component density. Component density on printed circuit boards continues to decrease with a corresponding increase in component complexity and reduction in pitches. Good examples of these industrial trends are smart phones, tablets and wearables.

Topics: [BGA](https://info.techcon.com/metcal/topic/bga) [PCB](https://info.techcon.com/metcal/topic/pcb) [desoldering](https://info.techcon.com/metcal/topic/desoldering) [rework](https://info.techcon.com/metcal/topic/rework) [risk mitigation](https://info.techcon.com/metcal/topic/risk-mitigation) 

[Continue Reading](https://info.techcon.com/metcal/metcal-whitepapers-risk-mitigation-and-rework-challenges)

## [Industry Trends Making Manual PCB Cleaning Increasingly More Challenging](https://info.techcon.com/metcal/industry-trends-making-manual-pcb-cleaning-increasingly-more-challenging)

 By [Metcal Marketing](https://info.techcon.com/metcal/author/metcal-marketing) on Oct 27, 2016 1:30:07 PM

[![](http://info.okinternational.com/hubfs/Metcal/1ScarabBlog3.jpg)](https://info.techcon.com/metcal/industry-trends-making-manual-pcb-cleaning-increasingly-more-challenging)

In addition to PCBs becoming thicker over the years, pad and pitch size have also reduced significantly, with many smartphones and other devices now utilizing pad sizes as small as .25mm millimeters spaced at intervals of .5mm. It is known in the industry that new chips are scheduled for release in the next two to three years that utilize designs calling for pad sizes as small as .15 mm with a .3 mm pitch. With adjacent parts so close together, avoiding hitting them with the wick during manual cleaning—and creating another round of rework—will most likely become impossible for even the most skilled technician.

Further, traditional cleaning methods can be even less effective when it comes to cleaning PCBs incorporating advanced chip technologies. For example, one new technology is providing outstanding improvements in security, making it nearly impossible for criminals to access data stored on the processor. However, due to factors such as differing size pads and uneven solder volumes, manual cleaning can be a significant challenge. 

 

Another technology, Ceramic Ball Grid Array (CBGA), a specialty process used in aerospace, military and other high reliability applications, is another high value case in point. These boards,

Topics: [contactless solder cleaning](https://info.techcon.com/metcal/topic/contactless-solder-cleaning) [Scarab](https://info.techcon.com/metcal/topic/scarab) [BGA](https://info.techcon.com/metcal/topic/bga) [CBGA](https://info.techcon.com/metcal/topic/cbga) [PCB](https://info.techcon.com/metcal/topic/pcb) [rework](https://info.techcon.com/metcal/topic/rework) 

[Continue Reading](https://info.techcon.com/metcal/industry-trends-making-manual-pcb-cleaning-increasingly-more-challenging)

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Metcal is a benchtop solutions expert that has delivered broad value to customers since its Silicon Valley beginnings in 1982. Offering unrivalled performance, risk mitigation, and ROI, we give electronics manufacturers the tools—and the confidence—they need to develop faster, safer, more advanced products.

Metcal’s track record of innovation is legendary. With SmartHeat® and now with Connection Validation™—both industry firsts—Metcal breakthroughs have empowered our global electronics assembly customers in the automotive, aerospace, medical devices, and military sectors. And today, we’re accelerating the pace of global innovation even further, forging developments in hand soldering, convection rework, fume extraction, and fluid dispensing.

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