TS9800 Series
The Fastest Non-Contact Jet Dispensing System


Key Features

  • Fast dispensing with high-speed piezo actuator
  • Micro shot size for small component applications
  • Quick and easy setup
  • Low to high viscosity fluid jetting
  • Localized fluid housing heater
  • Fully adjustable parameter settings with touch screen interface

Applications

  • LCDs/OLEDs edge and end sealing
  • Die and frame bonding for camera module assembly
  • Jetting silicone phosphor in the LED assembly
  • Jetting under-fill in micro-electronic package applications
  • UV adhesive micro dots jetting in medical device applications
DOWNLOAD DATASHEET

New White Paper: JET DISPENSING TECHNOLOGY - SHOOTING FOR PERFECTION

By Can La, Global Product Manager, Techcon

Learn the advantages and limitations, history, and development of contact and non-contact dispensing technology.

Key Advantages of the TS9800 Jet Valve System

20x faster dispensing speeds compared to a contact dispensing valve

2x faster dispensing speeds compared to a pneumatic jet valve

Frequency up to 1500Hz continuous and up to 2000Hz burst for high throughput

Non-contact jetting technology allows the valve to dispense fluid in hard-to-reach places

Reduces downtime and scrap by eliminating risk of needle crashing into the workpiece

Quick and easy part replacement without the need for time consuming process adjustments

LEARN MORE CONTACT US

Typical applications include:

Electronics

  • Edge sealing, end sealing of LCDs and OLEDs
  • Die bonding, Frame bonding for camera module assembly
  • Jetting silicone phosphor in the LED assembly process
  • Jetting under-fill in micro-electronic package applications on PCBA

LED Assembly

  • Jetting silicone phosphor
  • Jetting under-fill for flip chip LEDs
  • Jetting conformal coating

Medical Device & Life Science

  • Jetting UV adhesives for bonding
  • Jetting sealant for gasketing
  • Jetting reagents to test strips

Medical Assembly

  • Jetting UV sealant for gasketing
  • Jetting greases for lubrication
  • Jetting ink for marking
Valve Specifications

Valve Size (mm) H x W x D

125 mm x 102 mm x 16 mm

Valve Size (inches) H x W x D

4.9" H x 4.0" W x 0.63" D

Valve Weight

258 g

Max Fluid Pressure

6.9 Bars (100 psi)

Nozzle Orifice Diameter Range

0.05 mm to 0.40 mm

Minimum Shot Size

< 2 nL

Max. Dispensing Frequency

1500 Hz Continuous, 2000 Hz Burst

Wetted Parts

Stainless Steel, Tungsten Carbide, PEEK, EPDM, FFKM

Fluid Pressure

0.07 to 6.9 Bars (1.0 to 100.0 psi)

Fluid Viscosity

1 - 2 million cps

Operating Frequency

1 - 1500 Hz (Depending on Parameter Settings

Response Time

1 µs

Operating Temperature Range

10 - 50 °C (50 - 122 °F)



Smart Controller Specifications

Controller Size (mm) H x W x D

126 mm H x 137 mm W x 181 mm D
(dimensions without cables)

Controller Size (inch) H x W x D

4.96" H x 5.40" W x 7.13" D
(dimensions without cables)

Controller Weight

2110 g

Parameter Sets Memory

50 Sets Internally, Unlimited External

Standard Interface

DB15, RS-232, Ethernet, USB

Operating Temperature

10 - 50 °C (50 - 122 °F)

Power Connection

110/240 VAC; 50/60 Hz

Certification

TUV, KC, PSE, CE

Display

Color, Touchscreen

Maximum Heating Temperature

90 °C (194 °F)

Interfaces

DC, 9-pin, 15-pin, Multi-pin, USB, Ethernet, MicroSD, Air In/Out

Operating Temperature Range

10 - 50 °C (50 - 122 °F)

Ventilation Concept

Convection Airing, Internal Cooling Fan

Line Voltage

100 - 240 VAC

Line Frequency

50/60 Hz

Controller Max. Power Consumption

221 Watts